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Aug 13, 2023

Schurter announces solid state SMD fuse for demanding applications

August 21, 2017 By Chris Newmarker Schurter recently announced its new High Current Fuse (HCF), which it is touting as a robust SMD fuse. The High Current fuse uses solid-state, thin-film technology.

August 21, 2017 By Chris Newmarker

Schurter recently announced its new High Current Fuse (HCF), which it is touting as a robust SMD fuse.

The High Current fuse uses solid-state, thin-film technology. It has fast-reacting breaking capacity rated 1000 A at 125 VAC/ 125 VDC, over a current range of 5 A to 15A. Schurter (Santa Rosa, Calif.) says the HCF is ideal for applications including medical devices, where the reliable interrupt of high currents is critical. In contrast to conventional fuses with a melting wire, the HCF has a metallic thin film layer. With this manufacturing technique, a metal layer is applied in conjunction with a so-called sputter. The two form on a glass substrate in an exact micrometer thickness. The resulting fuse element is enclosed with a ceramic housing, that guarantees the necessary stability and

In contrast to conventional fuses with a melting wire, the HCF has a metallic thin film layer, applied in conjunction with a so-called sputter. The two form on a glass substrate in an exact micrometer thickness, with the resulting fuse element enclosed with a ceramic housing.

The Schurter HCF is completely impermeable to potting compound, which can be used to achieve a hermetic seal.

(See the best minds in medtech live at DeviceTalks Boston on Oct. 2.)